Substrate processing apparatus, process fluid treating apparatus, and ozone decomposition method

ABSTRACT

Disclosed are a substrate processing apparatus and a process fluid treating apparatus. The substrate processing apparatus includes a process chamber that processes a substrate with a process fluid including ozone, a discharge conduit connected to the process chamber to discharge the process fluid used to process the substrate, and a process fluid treating apparatus connected with the discharge conduit. The process fluid treating apparatus includes a housing having an inner space with a set volume in which the process fluid is received and an injection nozzle connecting the discharge conduit and the inner space of the housing.

CROSS-REFERENCE TO RELATED APPLICATIONS

A claim for priority under 35 U.S.C. § 119 is made to Korean PatentApplication No. 10-2016-0140261 filed on Oct. 26, 2016, in the KoreanIntellectual Property Office, the entire contents of which are herebyincorporated by reference.

BACKGROUND

Embodiments of the inventive concept described herein relate to asubstrate processing apparatus, a process fluid treating apparatus, andan ozone decomposition method.

A substrate is subjected to a variety of processes, such asphotolithography, etching, ashing, ion implantation, thin-filmdeposition, cleaning, and the like, to manufacture a semiconductordevice or a liquid crystal display. Among these processes, an etchingprocess is used to remove unnecessary regions from a thin film formed onthe substrate, and a high etching selectivity and a high etch rate arerequired for the thin film.

In an etching or cleaning process, a chemical treatment step, a rinsingstep, and a drying step are generally performed on a substrate in aserial order. In the chemical treatment step, a chemical is supplied tothe substrate to etch a thin film formed on the substrate or to removeforeign substances on the substrate, and in the rinsing step, a rinsingsolution, such as DI water, is supplied to the substrate. Furthermore,fluid used to process the substrate may include ozone.

SUMMARY

Embodiments of the inventive concept provide a substrate processingapparatus, a process fluid treating apparatus, and an ozonedecomposition method that effectively process a substrate.

According to an aspect of an embodiment, a substrate processingapparatus includes a process chamber that processes a substrate with aprocess fluid including ozone, a discharge conduit connected to theprocess chamber to discharge the process fluid used to process thesubstrate, and a process fluid treating apparatus connected with thedischarge conduit. The process fluid treating apparatus includes ahousing having an inner space with a set volume in which the processfluid is received and an injection nozzle that connects the dischargeconduit and the inner space of the housing.

The injection nozzle may inject the process fluid downwards.

The injection nozzle may include a plurality of injection holes throughwhich the process fluid is injected.

The injection nozzle may inject the process fluid by a spray method.

The process fluid treating apparatus may further include a strike platelocated inside the housing such that a top side of the strike platefaces the process fluid injected through the injection nozzle.

The process fluid treating apparatus may further include a gas supplyconduit that supplies gas including oxygen into the inner space of thehousing.

The process fluid treating apparatus may further include a circulationline that has opposite ends connected to the housing and allows theprocess fluid discharged from the housing to flow into the housingagain.

The process fluid treating apparatus may further include a gas supplyconduit that supplies gas including oxygen into the inner space of thehousing.

The process fluid treating apparatus may further include a strike platelocated inside the housing such that a top side of the strike platefaces the process fluid injected through the injection nozzle, and thegas supply conduit may include an upper injection part that extendstoward the inner space of the housing and injects the gas into a spacebetween the injection nozzle and the strike plate.

The gas supply conduit may include a lower injection part that extendstoward the inner space of the housing and injects the gas into theprocess fluid received in the inner space of the housing.

The process fluid treating apparatus may further include a circulationline that has opposite ends connected to the housing and allows theprocess fluid discharged from the housing to flow into the housingagain.

The circulation line may have a turbulence creating part therein toallow the process fluid flowing through the circulation line to becometurbulent.

The turbulence creating part may have a plate shape with one or moreflow holes.

The flow holes may be formed to be inclined with respect to an axialdirection of the circulation line.

The turbulence creating part may include a first plate and a secondplate that block a part of a flow passage inside the circulation lineand are located to have different slopes with respect to an axialdirection of the circulation line.

A pump may be located on the circulation line.

A heater may be located on the circulation line.

A circulation nozzle may be located at one end of the circulation linethrough which the process fluid flowing through the circulation lineflows into the housing again.

The circulation nozzle may inject the process fluid downwards.

The process fluid treating apparatus may further include a strike platelocated inside the housing such that a top side of the strike platefaces the process fluid injected through the injection nozzle.

The process fluid treating apparatus may further include a gas supplyconduit that supplies gas including oxygen into the inner space of thehousing.

According to another aspect of an embodiment, a process fluid treatingapparatus includes a housing having an inner space with a set volume inwhich a process fluid including ozone is received, a discharge conduitconnected to the housing to supply the process fluid into the innerspace of the housing, and a strike plate located in a moving path of theprocess fluid introduced by the discharge conduit.

The process fluid treating apparatus may further include an injectionnozzle located on an end portion of the discharge conduit to inject theprocess fluid into the inner space of the housing.

According to another aspect of an embodiment, a process fluid treatingapparatus includes a housing having an inner space with a set volume inwhich a process fluid including ozone is received, a discharge conduitconnected to the housing to supply the process fluid into the innerspace of the housing, and a circulation line that has opposite endsconnected to the housing and allows the process fluid discharged fromthe housing to flow into the housing again.

The circulation line may have a turbulence creating part therein toallow the process fluid flowing through the circulation line to becometurbulent.

A pump may be located on the circulation line.

A heater may be located on the circulation line.

A circulation nozzle that injects the process fluid downwards may belocated at one end of the circulation line through which the processfluid flowing through the circulation line flows into the housing again.

According to another aspect of an embodiment, a method of decomposingozone included in a process fluid includes recovering the process fluid,which includes the ozone and has been used to process a substrate, intoan inner space of a housing, in which case the process fluid is injectedinto the inner space of the housing by a spray method.

The process fluid may be injected toward a strike plate disposed in theinner space of the housing.

The method may further include circulating the process fluid injectedinto the housing through a circulation line and decomposing the ozone byusing a force applied to the process fluid in the circulation process.

The process fluid may flow through the circulation line while creatingturbulence.

The process fluid may be heated while flowing through the circulationline.

Gas including oxygen may be supplied into the inner space of thehousing.

The gas may be supplied to a part into which the process fluid isinjected.

The gas may be supplied into the process fluid that is received in thehousing after injected.

According to embodiments of the inventive concept, it is possible toprovide a substrate processing apparatus, a process fluid treatingapparatus, and an ozone decomposition method that are capable ofeffectively processing a substrate.

BRIEF DESCRIPTION OF THE FIGURES

The above and other objects and features will become apparent from thefollowing description with reference to the following figures, whereinlike reference numerals refer to like parts throughout the variousfigures unless otherwise specified, and wherein:

FIG. 1 is a plan view of a substrate processing apparatus according toan embodiment of the inventive concept;

FIG. 2 illustrates a connection relation between elements for supplyinga process fluid to a process chamber and recovering the same from theprocess chamber;

FIG. 3 illustrates a process fluid treating apparatus;

FIG. 4 illustrates an injection nozzle;

FIG. 5 is a partially sectioned view of a circulation line;

FIG. 6 is a longitudinal sectional view of a turbulence creating part;

FIG. 7 is a partially sectioned view of a circulation line according toanother embodiment; and

FIG. 8 illustrates a process fluid treating apparatus according toanother embodiment.

DETAILED DESCRIPTION

Hereinafter, embodiments of the inventive concept will be described inmore detail with reference to the accompanying drawings. The inventiveconcept may, however, be embodied in different forms and should not beconstructed as limited to the embodiments set forth herein. Rather,these embodiments are provided so that this disclosure will be thoroughand complete, and will fully convey the scope of the inventive conceptto those skilled in the art. In the drawings, the dimensions of elementsare exaggerated for clarity of illustration.

FIG. 1 is a plan view of a substrate processing apparatus according toan embodiment of the inventive concept.

Referring to FIG. 1, a substrate processing apparatus 1 includes anindex module 10 and a process module 20. The index module 10 has aplurality of load ports 11 and a transfer frame 14. The load ports 11,the transfer frame 14, and the process module 20 are sequentiallyarranged in a row. Hereinafter, the direction in which the load ports11, the transfer frame 14, and the process module 20 are arranged isreferred to as a first direction 2. When viewed from above, a directionperpendicular to the first direction 2 is referred to as a seconddirection 3, and a direction perpendicular to a plane that includes thefirst direction 2 and the second direction 3 is referred to as a thirddirection 4.

Carriers 13 having substrates W received therein are seated on the loadports 11, respectively. The plurality of load ports 11 are arranged in arow in the second direction 3. Four load ports 11 are illustrated inFIG. 1. However, the number of load ports 11 may increase or decreasedepending on conditions, such as process efficiency and footprint of theprocess module 20. Each carrier 13 has a plurality of slots (notillustrated) formed therein to support edges of the substrates W. Theplurality of slots are arranged in the third direction 4, and thesubstrates W are located in the carrier 13 so as to be stacked one aboveanother in the third direction 4 with a spacing gap therebetween. Afront opening unified pod (FOUP) may be used as the carrier 13.

The process module 20 has a buffer unit 22, a transfer chamber 25, andprocess chambers 26. The transfer chamber 25 is arranged such that thelongitudinal direction thereof is parallel to the first direction 2. Theprocess chambers 26 are disposed on opposite sides of the transferchamber 25 in the second direction 3. The process chambers 26 on oneside of the transfer chamber 25 and the process chambers 26 on theopposite side of the transfer chamber 25 are located in a symmetricarrangement with respect to the transfer chamber 25. Some of the processchambers 26 are arranged in the longitudinal direction of the transferchamber 25. Furthermore, the other process chambers 26 are stacked oneabove another. That is, the process chambers 26 may be arranged in anA×B array (A and B being natural numbers of 1 or larger) on the oppositesides of the transfer chamber 25. Here, A is the number of rows in whichthe process chambers 26 are arranged in the first direction 2, and B isthe number of columns in which the process chambers 26 are arranged inthe third direction 4. In the case where four or six process chambers 26are disposed on the opposite sides of the transfer chamber 25, theprocess chambers 26 may be arranged in a 2×2 or 3×2 array. The number ofprocess chambers 26 may increase or decrease. Alternatively, the processchambers 26 may be disposed on only one side of the transfer chamber 25.In another case, the process chambers 26 may be disposed in a singlelayer on the opposite sides of the transfer chamber 25.

The buffer unit 22 is disposed between the transfer frame 14 and thetransfer chamber 25. The buffer unit 22 has a space in which substratesW stay before transferred between the transfer chamber 25 and thetransfer frame 14. The buffer unit 22 has a plurality of slots (notillustrated) therein, on which substrates W are placed. The plurality ofslots (not illustrated) are separated from one another in the thirddirection 4. The buffer unit 22 is open at one side facing the transferframe 14 and at an opposite side facing the transfer chamber 25.

The transfer frame 14 transfers substrates W between the carriers 13seated on the load ports 11 and the buffer unit 22. The transfer frame14 includes an index rail 17 and an index robot 16. The index rail 17 isarranged such that the longitudinal direction thereof is parallel to thesecond direction 3. The index robot 16 is installed on the index rail 17and linearly moves along the index rail 17 in the second direction 3.The index robot 16 has a base 16 a, a body 16 b, and a plurality ofindex arms 16 c. The base 16 a is installed so as to be movable alongthe index rail 17. The body 16 b is coupled to the base 16 a. The body16 b may be configured to move on the base 16 a in the third direction4. Furthermore, the body 16 b may be configured to rotate on the base 16a. The plurality of index arms 16 c are coupled to the body 16 b to moveforward and rearward relative to the body 16 b. The plurality of indexarms 16 c may operate individually. The index arms 16 c are stacked oneabove another in the third direction 4 with a spacing gap therebetween.Some of the index arms 16 c may be used to transfer substrates W fromthe process module 20 to the carriers 13, and the other index arms 16 cmay be used to transfer substrates W from the carriers 13 to the processmodule 20. Accordingly, it is possible to prevent particles generatedfrom substrates W to be processed from adhering to processed substratesW in the process in which the index robot 16 carries the substrates Winto and out of the process module 20.

The transfer chamber 25 transfers substrates W between the buffer unit22 and the process chambers 26 and between the process chambers 26. Thetransfer frame 25 includes a guide rail 29 and a main robot 24. Theguide rail 29 is arranged such that the longitudinal direction thereofis parallel to the first direction 2. The main robot 24 is installed onthe guide rail 29 and linearly moves along the guide rail 29 in thefirst direction 2. The main robot 24 has a base 24 a, a body 24 b, and aplurality of main arms 24 c. The base 24 a is installed so as to bemovable along the guide rail 29. The body 24 b is coupled to the base 24a. The body 24 b may be configured to move on the base 24 a in the thirddirection 4. Furthermore, the body 24 b may be configured to rotate onthe base 24 a. The plurality of main arms 24 c are coupled to the body24 b to move forward and rearward relative to the body 24 b. Theplurality of main arms 24 c may operate individually. The main arms 24 care stacked one above another in the third direction 4 with a spacinggap therebetween. The main arm 24 c used to transfer substrates W fromthe buffer unit 22 to the process chambers 26 may differ from the mainarm 24 c used to transfer substrates W from the process chambers 26 tothe buffer unit 22.

The process chambers 26 have substrate processing apparatuses 30therein, respectively, to perform a cleaning process on a substrate W.The substrate processing apparatuses 30 (see FIG. 2) in the respectiveprocess chambers 26 may have different structures according to the typesof cleaning processes to be performed. Alternatively, the substrateprocessing apparatuses 30 in the respective process chambers 26 may havethe same structure. In another case, the process chambers 26 may bedistinguished into a plurality groups; and the substrate processingapparatuses 30 in the process chambers 26 belonging to the same groupmay have the same structure, and the substrate processing apparatuses 30in the process chambers 26 belonging to different groups may havedifferent structures. For example, in the case where the processchambers 26 are distinguished into two groups, a first group of processchambers 26 may be disposed on one side of the transfer chamber 25, anda second group of process chambers 26 may be disposed on the oppositeside of the transfer chamber 25. Alternatively, on the opposite sides ofthe transfer chamber 25, the first group of process chambers 26 may bedisposed in a lower layer, and the second group of process chambers 26may be disposed in an upper layer. The first group of process chambers26 may be distinguished from the second group of process chambers 26according to the types of chemicals to be used and the types of cleaningmethods.

FIG. 2 illustrates a connection relation between elements for supplyinga process fluid to a process chamber and recovering the same from theprocess chamber.

Referring to FIG. 2, the process chamber 26 is connected with a processfluid supply 31 and a process fluid treating apparatus 32. A processfluid may be ozone water or a mixture of ozone water and a liquidchemical.

The process chamber 26 has a nozzle 100 and a cup 200 inside. Theprocess fluid supply 31 supplies the process fluid to the nozzle 100through a supply conduit 110. While FIG. 2 illustrates that the processfluid supply 31 is connected with the single process chamber 26, theprocess fluid supply 31 may be connected with two or more processchambers 26. The process fluid supplied to a substrate through thenozzle 100 to perform a process is recovered by the cup 200 and thendischarged through a discharge conduit 210 connected to the cup 200. Arecovery conduit 220 may be connected to the discharge conduit 210 andthe process fluid supply 31 to supply the process fluid recoveredthrough the cup 200 to the process fluid supply 31.

FIG. 3 illustrates a process fluid treating apparatus, and FIG. 4illustrates an injection nozzle.

The process fluid treating apparatus 32 is connected to the dischargeconduit 210 to remove ozone included in a process fluid or to reduce theamount of ozone included in the process fluid.

Referring to FIG. 3, the process fluid treating apparatus 32 includes ahousing 300, an injection nozzle 310, a gas supply conduit 320, a strikeplate 330, and a circulation line 350.

The housing 300 has a space in which to receive the process fluidintroduced through the discharge conduit 210. The housing 300 has aninner space formed therein to receive a set amount of process fluid.

The injection nozzle 310 connects the discharge conduit 210 and theinner space of the housing 300 to allow the process fluid introducedinto the discharge conduit 210 to be supplied into the inner space ofthe housing 300. The injection nozzle 310 has a plurality of injectionholes 311 formed therein, and the process fluid may be injected throughthe injection holes 311 in the form of a plurality of streams or in amist form by a spray method. Accordingly, it is possible to increase acontact area between the process fluid and gas in the inner space of thehousing 300, thereby enhancing the degree of decomposition of ozoneincluded in the process fluid.

The gas supply conduit 320 supplies, into the inner space of the housing300, a decomposition gas that reacts with ozone included in the processfluid to facilitate decomposition of the ozone. The decomposition gasincludes oxygen. For example, the decomposition gas may be air.

The strike plate 330 is disposed in the inner space of the housing 300.The strike plate 330 is located such that one side thereof faces theprocess fluid injected through the injection nozzle 310. For example,the injection nozzle 310 may be located on the top side or a lateralside of the housing 300 to inject the process fluid downwards. A part ofa lateral side of the strike plate 330 may be secured to an inside ofthe housing 300, and the top side of the strike plate 330 may be locatedin the path along which the process fluid injected through the injectionnozzle 310 moves. Accordingly, the process fluid injected through theinjection nozzle 310 collides with the strike plate 330, and the degreeof decomposition of ozone is enhanced by forces applied to the processfluid during the collision and an effect, such as an increase in thearea by which particles react with the gas while being broken in ascattering process after the collision.

FIG. 5 is a partially sectioned view of a circulation line, and FIG. 6is a longitudinal sectional view of a turbulence creating part.

The circulation line 350 provides a path along which the process fluidreceived in the housing 300 circulates. One end of the circulation line350 is connected to the bottom of the housing 300, and the process fluidreceived in the housing 300 flows into the circulation line 350. Anopposite end of the circulation line 350 is connected to the top of thehousing 300, and the process fluid in the circulation line 350 flowsinto the housing 300 again. The circulation line 350 has one or moreturbulence creating parts 3000 therein. The turbulence creating parts3000 have a plate shape having one or more flow holes 3100 formedtherein. Accordingly, the circulating fluid becomes turbulent whilecolliding with the turbulence creating parts 3000 and flowing throughthe flow holes 3100, and forces caused by the turbulent flow facilitatedecomposition of ozone. The flow holes 3100 formed in the turbulencecreating parts 3000 may be inclined with respect to the axial directionof the circulation line 350. Accordingly, the flow direction of theprocess fluid passing through the flow holes 3100 may be inclined withrespect to the axial direction of the circulation line 350, and thusturbulence may be easily created. Furthermore, in the case where theturbulence creating part 3000 has the plurality of flow holes 3100formed therein, the flow holes 3100 may be inclined in differentdirections to enhance the degree to which turbulence is created.

A pump 351 may be located on the circulation line 350. The pump 351 maybe located adjacent to the one end of the circulation line 350 intowhich the process fluid flows. The pump 351 applies pressure to theprocess fluid to allow the process fluid to effectively flow whilecreating turbulence. Furthermore, the pressure applied by the pump 351may facilitate decomposition of ozone included in the process fluid.

A heater 352 may be located on the circulation line 350. The heater 352may heat the process fluid to facilitate the decomposition of ozone.

A circulation nozzle 353 is located at the opposite end of thecirculation line 350. The circulation nozzle 353 has a plurality ofholes formed therein, similarly to the injection nozzle 310 of FIG. 4.Accordingly, the process fluid flowing into the housing 300 againthrough the circulation line 350 may be injected in the form of aplurality of streams or in a mist form, and thus the degree ofdecomposition of ozone may be enhanced. The circulation nozzle 353 maybe located on the top side or a lateral side of the housing 300 toinject the process fluid downwards toward the strike plate 330, therebypermitting the injected process fluid to collide with the strike plate330.

If ozone included in the process fluid is decomposed as a setting timepasses, a discharge valve 371 on a discharge line 370 connected to thebottom of the housing 300 is opened to discharge the process fluid fromthe housing 300. The gas inside the housing 300 may be dischargedthrough a gas discharge line 360 by opening a gas discharge valve 361 onthe gas discharge line 360. The discharge of the gas inside the housing300 may be performed while ozone is being decomposed.

FIG. 7 is a partially sectioned view of a circulation line according toanother embodiment.

Referring to FIG. 7, turbulence creating parts 3200 may include a firstplate 3210 and a second plate 3220. The first plate 3210 and the secondplate 3220 may have a plate shape and may be located to block a part ofa flow passage inside a circulation line 350 a. The first plate 3210 andthe second plate 3220 may be installed at different slopes with respectto the axial direction of the circulation line 350 a. For example, thefirst plate 3210 and the second plate 3220 may be obliquely installed indifferent directions from the axial direction of the circulation line350 a, as illustrated in FIG. 7. In another example, one of the firstplate 3210 and the second plate 3220 may be installed to beperpendicular to the axial direction of the circulation line 350 a, andthe other may be obliquely installed to be inclined with respect to theaxial direction of the circulation line 350 a. Accordingly, a processfluid may collide with the turbulence creating parts 3200 in a flowprocess and may flow through the space between the first plate 3210 andthe second plate 3220 while creating turbulence, thereby facilitatingdecomposition of ozone included in the process fluid.

FIG. 8 illustrates a process fluid treating apparatus according toanother embodiment.

Referring to FIG. 8, a process fluid treating apparatus 32 a includes ahousing 300 a, an injection nozzle 310 a, a gas supply conduit 320 a, astrike plate 330 a, and a circulation line 350 a.

Since the housing 300 a, the injection nozzle 310 a, the strike plate330 a, the circulation line 350 a, a discharge line 370 a, a gasdischarge line 360 a, and a pump 351 a, a heater 352 a, and acirculation nozzle 353 a located along the circulation line 350 a arethe same as those of the process fluid treating apparatus 32 of FIG. 3,repetitive descriptions thereof will be omitted.

The gas supply conduit 320 a extends toward an inner space of thehousing 300 a. The gas supply conduit 320 a includes an upper injectionpart 325. The upper injection part 325 is configured to inject adecomposition gas into the space between the injection nozzle 310 a andthe strike plate 330 a. Accordingly, a process fluid injected throughthe injection nozzle 310 a and a process fluid injected through thecirculation nozzle 353 a may make frequent contact with thedecomposition gas before and after a collision with the strike plate 330a, and thus the degree of decomposition of ozone may be enhanced.

The gas supply conduit 320 a further includes a lower injection part326. The lower injection part 326 is located in a lower inner space ofthe housing 300 a to inject a decomposition gas into a process fluidreceived in the housing 300 a. The lower injection part 326 may beinclined with respect to the vertical direction. For example, the lowerinjection part 326 may horizontally extend and may be configured tospray a decomposition gas from one or more locations thereof in thelongitudinal direction, thereby increasing contact between thedecomposition gas and the process fluid.

The above description exemplifies the inventive concept. Furthermore,the above-mentioned contents describe exemplary embodiments of theinventive concept, and the inventive concept may be used in variousother combinations, changes, and environments. That is, variations ormodifications can be made to the inventive concept without departingfrom the scope of the inventive concept that is disclosed in thespecification, the equivalent scope to the written disclosures, and/orthe technical or knowledge range of those skilled in the art. Thewritten embodiments describe the best state for implementing thetechnical spirit of the inventive concept, and various changes requiredin specific applications and purposes of the inventive concept can bemade. Accordingly, the detailed description of the inventive concept isnot intended to restrict the inventive concept in the disclosedembodiment state. In addition, it should be construed that the attachedclaims include other embodiments.

While the inventive concept has been described with reference toembodiments, it will be apparent to those skilled in the art thatvarious changes and modifications may be made without departing from thespirit and scope of the inventive concept. Therefore, it should beunderstood that the above embodiments are not limiting, butillustrative.

What is claimed is:
 1. A substrate processing apparatus comprising: aprocess chamber configured to process a substrate with a process fluidincluding ozone; a discharge conduit connected to the process chamber todischarge the process fluid used to process the substrate; and a processfluid treating apparatus connected with the discharge conduit, whereinthe process fluid treating apparatus includes: a housing having an innerspace with a set volume in which the process fluid is received; and aninjection nozzle configured to connect the discharge conduit with theinner space of the housing.
 2. The substrate processing apparatus ofclaim 1, wherein the injection nozzle is configured to inject theprocess fluid downwards.
 3. The substrate processing apparatus of claim1, wherein the injection nozzle includes a plurality of injection holesthrough which the process fluid is injected.
 4. The substrate processingapparatus of claim 1, wherein the injection nozzle is configured toinject the process fluid by a spray method.
 5. The substrate processingapparatus of claim 1, wherein the process fluid treating apparatusfurther includes: a strike plate located inside the housing such that atop side of the strike plate faces the process fluid injected throughthe injection nozzle.
 6. The substrate processing apparatus of claim 5,wherein the process fluid treating apparatus further includes: a gassupply conduit configured to supply gas including oxygen into the innerspace of the housing.
 7. The substrate processing apparatus of claim 6,wherein the process fluid treating apparatus further includes: acirculation line having opposite ends connected to the housing, thecirculation line being configured to allow the process fluid dischargedfrom the housing to flow into the housing again.
 8. The substrateprocessing apparatus of claim 1, wherein the process fluid treatingapparatus further includes: a gas supply conduit configured to supplygas including oxygen into the inner space of the housing.
 9. Thesubstrate processing apparatus of claim 8, wherein the process fluidtreating apparatus further includes: a strike plate located inside thehousing such that a top side of the strike plate faces the process fluidinjected through the injection nozzle, and wherein the gas supplyconduit includes an upper injection part extending toward the innerspace of the housing and configured to inject the gas into a spacebetween the injection nozzle and the strike plate.
 10. The substrateprocessing apparatus of claim 8, wherein the gas supply conduit includesa lower injection part extending toward the inner space of the housingand configured to inject the gas into the process fluid received in theinner space of the housing.
 11. The substrate processing apparatus ofclaim 1, wherein the process fluid treating apparatus further includes:a circulation line having opposite ends connected to the housing, thecirculation line being configured to allow the process fluid dischargedfrom the housing to flow into the housing again.
 12. The substrateprocessing apparatus of claim 11, wherein the circulation line has aturbulence creating part therein to allow the process fluid flowingthrough the circulation line to become turbulent.
 13. The substrateprocessing apparatus of claim 12, wherein the turbulence creating parthas a plate shape with one or more flow holes.
 14. The substrateprocessing apparatus of claim 13, wherein the flow holes are formed tobe inclined with respect to an axial direction of the circulation line.15. The substrate processing apparatus of claim 12, wherein theturbulence creating part includes a first plate and a second plateconfigured to block a part of a flow passage inside the circulation lineand located to have different slopes with respect to an axial directionof the circulation line.
 16. The substrate processing apparatus of claim11, wherein a pump is located on the circulation line.
 17. The substrateprocessing apparatus of claim 11, wherein a heater is located on thecirculation line.
 18. The substrate processing apparatus of claim 11,wherein a circulation nozzle is located at one end of the circulationline through which the process fluid flowing through the circulationline flows into the housing again.
 19. The substrate processingapparatus of claim 18, wherein the circulation nozzle is configured toinject the process fluid downwards.
 20. The substrate processingapparatus of claim 11, wherein the process fluid treating apparatusfurther includes: a strike plate located inside the housing such that atop side of the strike plate faces the process fluid injected throughthe injection nozzle.
 21. The substrate processing apparatus of claim11, wherein the process fluid treating apparatus further includes: a gassupply conduit configured to supply gas including oxygen into the innerspace of the housing.
 22. A process fluid treating apparatus comprising:a housing having an inner space with a set volume in which a processfluid including ozone is received; a discharge conduit connected to thehousing to supply the process fluid into the inner space of the housing;and a strike plate located in a moving path of the process fluidintroduced by the discharge conduit.
 23. The process fluid treatingapparatus of claim 22, further comprising: an injection nozzle locatedon an end portion of the discharge conduit to inject the process fluidinto the inner space of the housing.
 24. A process fluid treatingapparatus comprising: a housing having an inner space with a set volumein which a process fluid including ozone is received; a dischargeconduit connected to the housing to supply the process fluid into theinner space of the housing; and a circulation line having opposite endsconnected to the housing, the circulation line being configured to allowthe process fluid discharged from the housing to flow into the housingagain.
 25. The process fluid treating apparatus of claim 24, wherein thecirculation line has a turbulence creating part therein to allow theprocess fluid flowing through the circulation line to become turbulent.26. The process fluid treating apparatus of claim 24, wherein a pump islocated on the circulation line.
 27. The process fluid treatingapparatus of claim 24, wherein a heater is located on the circulationline.
 28. The process fluid treating apparatus of claim 24, wherein acirculation nozzle configured to inject the process fluid downwards islocated at one end of the circulation line through which the processfluid flowing through the circulation line flows into the housing again.29. A method of decomposing ozone included in a process fluid, themethod comprising: recovering the process fluid, which includes theozone and has been used to process a substrate, into an inner space of ahousing, wherein the process fluid is injected into the inner space ofthe housing by a spray method.
 30. The method of claim 29, wherein theprocess fluid is injected toward a strike plate disposed in the innerspace of the housing.
 31. The method of claim 29, further comprising:circulating the process fluid injected into the housing through acirculation line and decomposing the ozone by using a force applied tothe process fluid in the circulation process.
 32. The method of claim31, wherein the process fluid flows through the circulation line whilecreating turbulence.
 33. The method of claim 31, wherein the processfluid is heated while flowing through the circulation line.
 34. Themethod of claim 29, wherein gas including oxygen is supplied into theinner space of the housing.
 35. The method of claim 34, wherein the gasis supplied to a part into which the process fluid is injected.
 36. Themethod of claim 34, wherein the gas is supplied into the process fluidthat is received in the housing after injected.